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Vertical connectors operate at SAS-3 and projected SAS-4 bandwidths

Molex : 10 March, 2013  (New Product)
Molex introduces high density iPass+ zHD vertical connectors for midplane or other non-edge-board applications. The new iPass+ zHD vertical connector system provides a 0.75mm pitch vertical connector that meets requirements of SAS-3 and projected SAS-4 bandwidths. Driving next generation data rates and port-densities, low-profile iPass+ zHD connectors improve system airflow and signal integrity by eliminating midplane connections

Featuring a robust and secure connection, Molex iPass+ zHD connectors are scalable up to 96Gbps data rates (24Gbps over four lanes).  The new iPass+ zHD vertical connectors improve system airflow and reduce board-space constraints by providing flexible midplane design options.  The waferised connector design optimises the PCB footprint with low insertion loss, low integrated cross-talk noise, low return loss and only minimal performance variation across all high-speed channels.
The vertical press-fit iPass+ zHD connector nearly doubles the number of ports on the PCB, compared to convention iPass connectors.  One-step placement reduces both the time and costs associated with the wave solder process.  The iPass+ zHD connectors mate to all current miniSAS HD (Molex iPass+ HD) passive copper, active copper and optical cable assemblies.  A positive locking latch ensures secure mating retention to cable assemblies.
Available in multiple configurations (1-by-1, 1-by-2, 1-by-4), versatile press-fit iPass+ zHD connectors accommodate a range of high density data and networking applications.

“Limited airflow and high cross talk are becoming recurring problems in many servers and computing systems,” states Joe Dambach, new product development manager, Molex.  “The iPass+ zHD vertical connector solves these issues with a one-step placement, low-profile design that provides excellent signal integrity performance while maintaining a small footprint on the PCB.”

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